GB/Z 41275.4-2023
Avionics Process Management Aerospace and Defense Electronic Systems Containing Lead-Free Solder Part 4: Ball Grid Array Ball Installation (English Version)

Standard No.

GB/Z 41275.4-2023

Language

Chinese, Available in English version

Release Date

2023

Published By

General Administration of Quality Supervision, Inspection and Quarantine of the People‘s Republic of China

Latest

GB/Z 41275.4-2023

GB/Z 41275.4-2023 history

• 2023 GB/Z 41275.4-2023 Avionics Process Management Aerospace and Defense Electronic Systems Containing Lead-Free Solder Part 4: Ball Grid Array Ball Installation