GSO IEC 60191-6-22:2017
Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silico

Standard No.

GSO IEC 60191-6-22:2017

Release Date

2017

Published By

GSO

Latest

GSO IEC 60191-6-22:2017

Scope

This part of IEC 60191 provides the outline drawings and dimensions common to siliconbased package structures and materials of ball grid array packages (BGA) and land grid array packages (LGA).

GSO IEC 60191-6-22:2017 history

• 2017 GSO IEC 60191-6-22:2017 Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silico