PD IEC TR 61760-5-1:2024
Surface mounting technology Part 5-1: Surface strain on circuit boards — Strain gauge measurement applied to chip components
- Standard No.
- PD IEC TR 61760-5-1:2024
- Release Date
- 2024
- Published By
- British Standards Institution (BSI)
- Latest
- PD IEC TR 61760-5-1:2024
- Scope
- This document describes examples of methods using electrical strain gauges for determination of critical mechanical stresses in assembly processes. These stresses can damage chip type ceramic components, causing so called “bending cracks”. Area-array components are excluded from the scope of this document.
PD IEC TR 61760-5-1:2024 history
- 2024 PD IEC TR 61760-5-1:2024 Surface mounting technology Part 5-1: Surface strain on circuit boards — Strain gauge measurement applied to chip components
Topics on standards and specifications
Standard and Specification
IEC TR 61760-5-1:2024 Surface mounting technology - Part 5-1: Surface strain on circuit boards - Strain gauge measurement applied to chip components
DS/EN 60749-40:2011 Semiconductor devices - Mechanical and climatic test methods - Part 40: Board level drop test method using a strain gauge
EN 60749-40:2011 Semiconductor devices - Mechanical and climatic test methods - Part 40: Board level drop test method using a strain gauge
IPC/JEDEC-9704-2005 Printed Wiring Board Strain Gage Test Guideline * NOT AVAILABLE
BS EN IEC 60749-37:2022 Semiconductor devices. Mechanical and climatic test methods. Board level drop test method using an accelerometer
GSO IEC 60749-37:2014 Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
CENELEC EN 60749-37-2008 Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer (IEC 60749-37:2008
BS EN 60749-37:2008 Semiconductor devices — Mechanical and climatic test methods — Part 37: Board level drop test method using an accelerometer
IEC 60749-37:2008 Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer