EN 61190-1-2:2007
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly

Standard No.: EN 61190-1-2:2007
Release Date: 2007
Published By: CENELEC - European Committee for Electrotechnical Standardization
Status: Be replaced
Replace By: EN 61190-1-2:2014
Latest: EN 61190-1-2:2014

EN 61190-1-2:2007 history

2014 EN 61190-1-2:2014 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
2007 EN 61190-1-2:2007 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
2002 EN 61190-1-2:2002 Attachment Materials for Electronic Assembly Part 1-2: Requirements for Solder Pastes for High-Quality Interconnections in Electronic Assembly