EN 62418:2010
Semiconductor devices - Metallization stress void test

Standard No.

EN 62418:2010

Release Date

2010

Published By

European Committee for Electrotechnical Standardization（CENELEC）

Latest

EN 62418:2010

Scope

IEC 62418:2010 describes a method of metallization stress void test and associated criteria. It is applicable to aluminium (Al) or copper (Cu) metallization.

EN 62418:2010 history

• 2010 EN 62418:2010 Semiconductor devices - Metallization stress void test