T/CASME 479-2023
Punched lead frame for plastic small outline packaging of semiconductor integrated circuits (English Version)

Standard No.

T/CASME 479-2023

Language

Chinese, Available in English version

Release Date

2023

Published By

Group Standards of the People's Republic of China

Latest

T/CASME 479-2023

Scope

This document specifies the terms and definitions, technical requirements, test methods, inspection rules, marking, packaging, transportation and storage of plastic small-outline packaging punched lead frames for semiconductor integrated circuits.

T/CASME 479-2023 history

• 2023 T/CASME 479-2023 Punched lead frame for plastic small outline packaging of semiconductor integrated circuits