General requirements for through-hole reflow soldering; appearance structure and design of through-hole reflow soldering components; printed board design for through-hole reflow soldering; requirements for through-hole reflow soldering process specifications; acceptance criteria for through-hole reflow soldering electronic components; Examples of typical defects in hole reflow soldering; template design guidelines; terminal position tolerances and hole fit; and relevant test and specification requirements for through-hole reflow soldering components.
T/BIE 003-2023 history
2023T/BIE 003-2023 Through Hole Reflow Soldering Specifications