IPC 7094-2009 PDF

Scope: This document describes the design and assembly challenges for implementing flip chip technology in a direct chip attach (DCA) assembly. The effect of bare die or die size components in a flip chip format has an impact on current component characteristics and dictates the appropriate assembly methodology. The focus on the information contained herein is on design@ assembly methodology@ critical inspection@ repair@ and reliability issues associated with flip chip@ and die size package technologies (including wafer level BGA). Purpose The target audiences for this document are managers@ design and process engineers@ and operators and technicians who deal with the electronic assembly@ inspection@ and repair processes. The intent is to provide useful and practical information to those who are mounting bare die or die size components in a DCA assembly or those who are considering flip chip process implementation.

IPC 7094-2009 history

2009 IPC 7094-2009 Design and Assembly Process Implementation for Flip Chip and Die Size Components