2019IEC 60068-2-67:1995/AMD1:2019 Amendment 1 — Environmental testing — Part 2-67: Tests — Test Cy: Damp heat, steady state, accelerated test primarily intended for components
2019IEC 60068-2-67:2019 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
1995IEC 60068-2-67:1995 Environmental testing - Part 2: Tests - Test Cy: Damp heat, steady state, accelerated test primarily intended for components