DIN EN 61189-5-4 E:2013-07
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies

Standard No.
DIN EN 61189-5-4 E:2013-07
Release Date
1970
Published By
/
Status
Replace By
DIN EN 61189-5-4:2015
Latest
DIN EN 61189-5-4:2015-11

DIN EN 61189-5-4 E:2013-07 history

  • 2015 DIN EN 61189-5-4:2015-11 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies (I...
  • 2015 DIN EN 61189-5-4:2015 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies (IEC
  • 1970 DIN EN 61189-5-4 E:2013-07 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies



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