This Engineering Bulletin and its annexes provide guidance to Original Equipment Manufacturers (OEMs) in evaluating device manufacturer flows and in selecting cost effective, standard products that meet the performance objective for potential use in many rugged, military, space, extreme, or other environments.
2009SAE SSB1_004A-2009 Failure Rate Estimating (Annex to SSB-1@ Guidelines for Using of Plastic Encapsulated Microcircuits and Semiconductors in Military@ Aerospace and Other Rugged Applications; Formerly TechAmerica SSB-1.004-A)
2002SAE SSB1_003A-2002 Acceleration Factors (Annex to SSB-1@ Guidelines for Using Plastic Encapsulated Microcircuits and Semiconductors in Military@ Aerospace and Other Rugged Applications; Formerly TechAmerica SSB-1.003-A)
2000SAE SSB1C-2000 Guidelines for Using Plastic Encapsulated Microcircuits and Semiconductors in Military@ Aerospace and Other Rugged Applications (Formerly TechAmerica SSB-1-C)
1999SAE SSB1B-1999 Guidelines for Using Plastic Encapsulated Microcircuits and Semiconductors in Military@ Aerospace and Other Rugged Applications (Formerly TechAmerica SSB-1-B)
1999SAE SSB1A-1999 Guidelines for Qualifying and Monitoring Plastic Encapsulated Microcircuits and Semiconductors (Formerly TechAmerica SSB-1-A)
1999SAE SSB1_004-1999 Failure Rate Estimating (Annex to SSB-1@ Guidelines for Using of Plastic Encapsulated Microcircuits and Semiconductors in Military@ Aerospace and Other Rugged Applications; Formerly TechAmerica SSB-1.004)
1999SAE SSB1-1999 Guidelines for Qualifying and Monitoring Plastic Encapsulated Microcircuits and Semiconductors (Formerly TechAmerica SSB-1)