TS 62647-22-2013 Process management for avionics – Aerospace and defence electronic systems containing lead-free solder – Part 22: Technical guidelines (Edition 1.0)
This part of IEC 62647 is intended for use as technical guidance by aerospace@ defence@ and high performance (ADHP) electronic applications and systems suppliers@ e.g.@ original equipment manufacturers (OEMs) and system maintenance facilities@ in developing and implementing designs and processes to ensure the continued performance@ quality@ reliability@ safety@ airworthiness@ configuration control@ affordability@ maintainability@ and supportability of high performance aerospace systems (subsequently referred to as ADHP) both during and after the transition to Pb-free electronics. The guidelines may be used by the OEMs and maintenance facilities to implement the methodologies they use to ensure the performance@ reliability@ airworthiness@ safety@ and certifiability of their products@ in accordance with IEC/TS 62647-1:2012. This document also contains lessons learned from previous experience with Pb-free aerospace electronic systems. The lessons learned give specific references to solder alloys and other materials@ and their expected applicability to various operating environmental conditions. The lessons learned are intended for guidance only; they are not guarantees of success in any given application. This document may be used by other high-performance and high-reliability industries@ at their discretion.
TS 62647-22-2013 history
2013TS 62647-22-2013 Process management for avionics – Aerospace and defence electronic systems containing lead-free solder – Part 22: Technical guidelines (Edition 1.0)