GB/T 41275.3-2022
Process management for avionics—Aerospace and defence electronic systems containing lead-free solder—Part 3：Performance testing for systems containing lead-free solder and finishes (English Version)

Scope: This document specifies the test methods, test procedures and instructions for system performance with lead-free solder and lead-free pins. This document is applicable to products transitioning to lead-free solders in aerospace and defense electronic systems, and can be used as a reference for other high-performance and high-reliability electronic industries. Note: Products transitioning to lead-free solder include:. ——Products that have passed the design and qualification of traditional lead-tin electronic components, materials and assembly processes, but are being requalified using lead-free components; ——Products that adopt tin-lead design and are converted to lead-free solder; — ---Newly designed products using lead-free solder; ---Assembly soldering level products, that is, printed board assembly level products.

GB/T 41275.3-2022 Referenced Document

IPC 9701 Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments

2022 GB/T 41275.3-2022 Process management for avionics—Aerospace and defence electronic systems containing lead-free solder—Part 3：Performance testing for systems containing lead-free solder and finishes