This standard specifies the test method for the bonding strength of the target material and the backing plate. This standard is applicable to the test method for the bonding strength of coating materials and backsheets used in the field of microelectronics. Note: The methods of combining the target and the backplate include calcium welding (traditional solder, conductive silver glue, nano micro welding, etc.), diffusion welding, electron beam or laser welding, explosion welding, friction welding, mechanical composite, cold spray, and thermal spray wait.
GB/T 39163-2020 history
2020GB/T 39163-2020 Test methods of the bonding strength for target-backing plate assemblies