T/CMIF 137-2021
Silver-gold alloy wire for semiconductor packaging bonding (English Version)

Standard No.

T/CMIF 137-2021

Language

Chinese, Available in English version

Release Date

2021

Published By

Group Standards of the People's Republic of China

Latest

T/CMIF 137-2021

T/CMIF 137-2021 history

• 2021 T/CMIF 137-2021 Silver-gold alloy wire for semiconductor packaging bonding