IEC 60326-6/AMD2:1990 Printed boards; part 6: specification for multilayer printed boards; amendment 6 to IEC 326-6:1980 was changed to IEC 62326-4-1:1996 Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification - Section 1: Capability detail specification - Performance levels A, B and C.
IEC 60326-6/AMD2:1990 Printed boards; part 6: specification for multilayer printed boards; amendment 6 to IEC 326-6:1980 was changed to IEC 62326-4:1996 Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification.
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