DIN EN IEC 61760-3:2022
Surface mount technology – Part 3: Standardized method for specifying through-hole components for reflow soldering (THR) (IEC 61760 3:2021)

Standard No.
DIN EN IEC 61760-3:2022
Release Date
2022
Published By
/
Status
Replace By
DIN EN IEC 61760-3:2022-07
Latest
DIN EN IEC 61760-3:2022-07

DIN EN IEC 61760-3:2022 history

  • 2022 DIN EN IEC 61760-3:2022-07 Surface mounting technology - Part 3: Standard method for the specification of components for through-hole reflow (THR) soldering (IEC 61760-3:2021); German version EN IEC 61760-3:2021 / Note: DIN EN 61760-3 (2010-12) remains valid alongside this stand...
  • 2022 DIN EN IEC 61760-3:2022 Surface mount technology – Part 3: Standardized method for specifying through-hole components for reflow soldering (THR) (IEC 61760 3:2021)
  • 1970 DIN EN IEC 61760-3 E:2019-12
Surface mount technology – Part 3: Standardized method for specifying through-hole components for reflow soldering (THR) (IEC 61760 3:2021)



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