KS C 0287-2022 Environmental test-Tests-Test Td:Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting device(SMD)
2022KS C 0287-2022 Environmental test-Tests-Test Td:Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting device(SMD)
0000 KS C 0287-2002(2017)
2002KS C 0287-2002 Environmental test-Tests-Test Td:Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting device(SMD)