IEC 60068-2-67:1995+A1:2019 provides a standard test procedure for the purpose of evaluating, in an accelerated manner, the resistance of small electrotechnical products, primarily non-hermetically sealed components, to the deteriorative effect of damp heat. The test is not intended to evaluate external effects such as corrosion and deformation. This consolidated version consists of the first edition (1995) and its amendment 1 (2019). Therefore, no need to order amendment in addition to this publication.
IEC 60068-2-67:1995+AMD1:2019 CSV history
2019IEC 60068-2-67:1995/AMD1:2019 Amendment 1 — Environmental testing — Part 2-67: Tests — Test Cy: Damp heat, steady state, accelerated test primarily intended for components
2019IEC 60068-2-67:2019 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
1995IEC 60068-2-67:1995 Environmental testing - Part 2: Tests - Test Cy: Damp heat, steady state, accelerated test primarily intended for components