PD IEC/TS 62647-4:2018
Process management for avionics. Aerospace and defence electronic systems containing lead-free solder. Ball grid array (BGA) re-balling
- Standard No.
- PD IEC/TS 62647-4:2018
- Release Date
- 2018
- Published By
- British Standards Institution (BSI)
- Latest
- PD IEC/TS 62647-4:2018
PD IEC/TS 62647-4:2018 history
- 2018 PD IEC/TS 62647-4:2018 Process management for avionics. Aerospace and defence electronic systems containing lead-free solder. Ball grid array (BGA) re-balling
