IEC 60249-3A:1976/COR1:1980 Corrigendum 1 - First supplement: Metal-clad base materials for printed circuits - Specification No. 2: Specification for copper foil for use in the manufacture of copper clad base materials
1970IEC 60249-3:1973/AMD1:1976 Amendment 1 - Metal-clad base materials for printed circuits - Part 3: Special materials used in connection with printed circuits
1970IEC 60249-3:1973 Metal-clad base materials for printed circuits - Part 3: Special materials used in connection with printed circuits