EN 62047-18:2013
Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials

Standard No.

EN 62047-18:2013

Release Date

2013

Published By

European Committee for Electrotechnical Standardization（CENELEC）

Latest

EN 62047-18:2013

Scope

IEC 62047-18:2013 specifies the method for bend testing of thin film materials with a length and width under 1 mm and a thickness in the range between 0,1 micrometre and 10 micrometre. This International Standard specifies the bend testing and test piece shape for micro-sized smooth cantilever type test pieces, which enables a guarantee of accuracy corresponding to the special features.

EN 62047-18:2013 history

• 2013 EN 62047-18:2013 Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials