IEC TR 62240-2:2018
Process management for avionics – Electronic components capability in operation – Part 2: Semiconductor microcircuit lifetime

Standard No.

IEC TR 62240-2:2018

Release Date

2018

Published By

International Electrotechnical Commission (IEC)

Latest

IEC TR 62240-2:2018

Scope

This part of IEC 62240@ which is a Technical Report@ focuses on original equipment manufacturers (OEMs) using commercial off the shelf (COTS) semiconductor microcircuits for high performance@ high reliability and long duration applications. This document supports OEMs in the preparation and maintenance of their semiconductor electronic component management plan (ECMP). This document describes a process and a method for selecting digital semiconductor microcircuits by ensuring that their lifetime is compatible with the requirements of aerospace@ defence and high performance (ADHP) applications (generally in connection with functional environments). Methods and guidelines are provided to assess the long term reliability of COTS semiconductor microcircuits in such applications; they mainly apply during the electronic design phase when selecting semiconductor microcircuits and assessing the application reliability. Moreover@ the document focuses on the intrinsic wear-out and the lifetime of COTS semiconductor microcircuits processed of less than or equal to 90 nm feature size (also called deep sub-micron (DSM) semiconductor microcircuits) and puts aside@ at this time@ packaging wear-out and random failure mechanisms. In this view@ physics of failure (PoF) is at the heart of the approach. NOTE 1 IEC 62239-1 can assist OEMs in the creation and maintenance of ECMPs. NOTE 2 SAE ARP6338 can also help the OEM with regard to assessment and mitigation of early wear-out of life-limited semiconductor microcircuits. NOTE 3 With the evolution of electronic technology and semiconductor microcircuits processed of less than or equal to 90 nm feature size@ the current MIL-HDBK-217 handbook or FIDES guide become inappropriate as they are based for the time being on the assumption that the semiconductor electronic component exhibits a constant (random) failure rate and does not have life limits or exhibit wear-out. Moreover@ silicon itself has fundamentally very low failures in time (FIT) rates and the major failure modes are often in the packaging (for example housing@ bond wires@ etc.).

IEC TR 62240-2:2018 history

• 2018 IEC TR 62240-2:2018 Process management for avionics – Electronic components capability in operation – Part 2: Semiconductor microcircuit lifetime