BS EN IEC 62878-2-5:2019
Device embedding assembly technology - Guidelines. Implementation of a 3D data format for device embedded substrate
- Standard No.
- BS EN IEC 62878-2-5:2019
- Release Date
- 2019
- Published By
- British Standards Institution (BSI)
- Latest
- BS EN IEC 62878-2-5:2019
- Scope
- What is BS EN IEC 62878 ‑ 2 ‑ 5 – Implementing the 3D data format for device embedded substrate about? BS EN IEC 62878 ‑ 2 ‑ 5 is the fifth sub-part of the second part of an international standard used for device embedding assembly technology that is useful in transferring the information from printed board designers to the manufacturers and assemblers. BS EN IEC 62878 ‑ 2 ‑ 5 best practice guidelines can help you in implementing the3D data format for device embedded substrate. BS EN IEC 62878 ‑ 2 ‑ 5 specifies requirements based on an XML schema that represents a design data format for device embedded substrate, which is a board comprising embedded active and passive devices whose electrical connections are made by means of a via, electroplating, conductive paste or printing of conductive material. This data format is to be used for simulation (e....
BS EN IEC 62878-2-5:2019 history
- 2019 BS EN IEC 62878-2-5:2019 Device embedding assembly technology - Guidelines. Implementation of a 3D data format for device embedded substrate
