IEC TR 62866:2014
Electrochemical migration in printed wiring boards and assemblies - Mechanisms and testing

Standard No.

IEC TR 62866:2014

Release Date

2014

Published By

International Electrotechnical Commission (IEC)

Latest

IEC TR 62866:2014

Scope

This Technical Report describes the history of the degradation of printed wiring boards caused by electrochemical migration@ the measurement method@ observation of the failure and remarks to testing in detail.

IEC TR 62866:2014 history

• 2014 IEC TR 62866:2014 Electrochemical migration in printed wiring boards and assemblies - Mechanisms and testing