BS EN IEC 61190-1-3:2018
Attachment materials for electronic assembly. Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications

Standard No.

BS EN IEC 61190-1-3:2018

Release Date

2020

Published By

British Standards Institution (BSI)

Latest

BS EN IEC 61190-1-3:2018

BS EN IEC 61190-1-3:2018 history

• 2020 BS EN IEC 61190-1-3:2018 Attachment materials for electronic assembly. Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications