SAE GEIASTD0005_1B-2023 Standard for Developing a Lead-Free Control Plan to Manage the Risks of Lead-Free Solders and Finishes in Aerospace, Defense, and High-Performance Soldered Electronic Products
This technical report identifies the requirements for an LFCP for ADHP soldered electronic products built fully or partially with Pb-free materials and assembly processes. An LFCP documents the specific Pb-free materials and assembly processes used to assure customers their ADHP soldered electronic products will meet the applicable reliability requirements of the customer. This standard specifically addresses LFCPs for: a Pb-free components and mixed assembly: Products originally designed and qualified with SnPb solder and assembly processes that incorporate components with Pb-free termination finishes and/or Pb-free BGAs, i.e., assembling Pb-free parts using eutectic/near-eutectic SnPb processes (also known as mixed metallurgy). b COTS products: COTS products likely built with Pb-free materials and assembly processes. c Pb-free design and assembly: Products designed and qualified with Pb-free solder and assembly processes.
SAE GEIASTD0005_1B-2023 history
2023SAE GEIASTD0005_1B-2023 Standard for Developing a Lead-Free Control Plan to Manage the Risks of Lead-Free Solders and Finishes in Aerospace, Defense, and High-Performance Soldered Electronic Products
2012SAE GEIASTD0005_1A-2012 Performance Standard for Aerospace and High Performance Electronic Systems Containing Lead-free Solder (Formerly TechAmerica GEIA-STD-0005-1-A)