IEC TS 62647-4:2018
Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 4: Ball grid array (BGA) re-balling
- Standard No.
- IEC TS 62647-4:2018
- Release Date
- 2018
- Published By
- International Electrotechnical Commission (IEC)
- Latest
- IEC TS 62647-4:2018
IEC TS 62647-4:2018 history
- 2018 IEC TS 62647-4:2018 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 4: Ball grid array (BGA) re-balling
