SAE ARP6415-2019 PDF

Scope: This document contains information and guidance on the use of Pb-free ball grid arrays (BGAs) in an aerospace@ defense@ and high performance (ADHP) product@ or other products which demand a high reliability. Purpose This document contains a review of known impacts@ issues@ and processes for the use of Pb-free BGAs. It is organized to provide the technical structure needed to allow the designer to evaluate the options for using Pb-free BGAs in an assembly that has not converted to full Pb-free assembly. Further@ it addresses the processes and risks associated with converting a Pb-free BGA to SnPb (reballing)@ soldering of Pb-free BGAs using SnPb solder (mixed-alloy soldering)@ and the application of underfill as a risk mitigation. A lead-free control plan (LFCP) or statement of work (SOW) flowed-down by a customer may include restrictions on the use of Pb-free BGAs@ or may contain specific requirements on qualification of their use for one of the methods described in this document. The LFCP and SOW should be reviewed for any such requirements and followed as appropriate.

SAE ARP6415-2019 history

2019 SAE ARP6415-2019 Use of Pb-Free Ball Grid Array Component Soldered Using SnPb Solder