This document provides a survey on the application environment profile of key communication materials such as high-frequency and high-speed substrate materials, high-frequency low-loss ceramic materials, antenna materials, printed boards and assembly process materials, advanced packaging materials, electromagnetic shielding materials and thermal conductive materials. Guidelines for reliability indicator requirements analysis and environmental reliability test program design. This document applies to key materials used in communications. Other products can refer to this document to carry out environmental reliability test design.
T/CSTM 00987-2023 history
2023T/CSTM 00987-2023 Design guideline of environment reliability test for communication materials