This document specifies the terms and definitions, requirements, test methods, inspection rules, packaging, marking, transportation and storage of module diodes for photovoltaic module junction boxes. This document applies to module diodes for junction boxes of terrestrial crystalline silicon photovoltaic modules whose semiconductor chip type is Schottky. For photovoltaic module diodes packaged by chips such as metal oxide semiconductor field effect transistors, please refer to some provisions of this document.
T/CPIA 0052-2023 history
2023T/CPIA 0052-2023 Module diodes for photovoltaic module junction boxes