T/ZZB 1718-2020
Gold bonding wire for semiconductor package (English Version)
- Standard No.
- T/ZZB 1718-2020
- Language
- Chinese, Available in English version
- Release Date
- 2020
- Published By
- Group Standards of the People's Republic of China
- Latest
- T/ZZB 1718-2020
- Scope
- This standard specifies the basic requirements, product classification and labeling, technical requirements, test methods, inspection rules, marking, packaging, transportation and storage, quality certificates, and quality commitments for bonding gold wires for semiconductor packaging (hereinafter referred to as gold wires). This standard applies to bonding wires for semiconductor discrete devices, integrated circuits, and LED packaging.
T/ZZB 1718-2020 history
- 2020 T/ZZB 1718-2020 Gold bonding wire for semiconductor package
