T/SHDSGY 052-2023
Low temperature curing single component low stress insulating adhesive (English Version)

Standard No.

T/SHDSGY 052-2023

Language

Chinese, Available in English version

Release Date

2023

Published By

Group Standards of the People's Republic of China

Latest

T/SHDSGY 052-2023

Scope

This document specifies the terms and definitions, requirements, test methods, inspection rules and signs, labels, instructions for use, packaging, transportation and storage of low-temperature curing single-component conductive adhesives. This document applies to low-temperature curing one-component conductive adhesives.

T/SHDSGY 052-2023 history

• 2023 T/SHDSGY 052-2023 Low temperature curing single component low stress insulating adhesive