Suitable for various types of communication laser chips produced in optoelectronic chip process rooms. In order to standardize the packaging of chip products, reduce losses caused by chip storage and transportation, and make it easier for users to use, we have formulated specifications for the packaging of chips in inventory and during shipment.
T/SBX 019-2019 history
2019T/SBX 019-2019 Storage Specifications for Optoelectronic Chips