T/CEPEA 0102-2023
Electrostatic chuck for etching process of compound semiconductor devices (English Version)

Standard No.
T/CEPEA 0102-2023
Language
Chinese, Available in English version
Release Date
2024
Published By
Group Standards of the People's Republic of China
Latest
T/CEPEA 0102-2023
Scope
The electrostatic chuck is an electrode group pattern with a specific functional structure set inside a dielectric material with a high relative dielectric constant, and is manufactured through integrated processes such as coagulation, sintering, and bonding. This document defines the terms and definitions of electrostatic chucks for compound semiconductor device etching processes, and stipulates their structure and classification, working conditions, technical requirements, test methods, inspection rules, marking, packaging, transportation and storage.

T/CEPEA 0102-2023 history

  • 2024 T/CEPEA 0102-2023 Electrostatic chuck for etching process of compound semiconductor devices



Copyright ©2024 All Rights Reserved