IEC TR 61760-3-1:2022
Surface mounting technology - Part 3-1: Standard method for the specification of components for through hole reflow (THR) soldering – Guidelines for through hole diameter design with solder paste surf
- Standard No.
- IEC TR 61760-3-1:2022
- Release Date
- 2022
- Published By
- International Electrotechnical Commission (IEC)
- Latest
- IEC TR 61760-3-1:2022
IEC TR 61760-3-1:2022 history
- 2022 IEC TR 61760-3-1:2022 Surface mounting technology - Part 3-1: Standard method for the specification of components for through hole reflow (THR) soldering – Guidelines for through hole diameter design with solder paste surf
