T/SHDSGY 160-2022
Technical specification for non-contact silicon wafert ransmission devices (English Version)

Standard No.

T/SHDSGY 160-2022

Language

Chinese, Available in English version

Release Date

2022

Published By

Group Standards of the People's Republic of China

Status

Be replaced 2023-06

Replace By

T/SHDSGY 160-2023

Latest

T/SHDSGY 160-2023

Scope

This document specifies the terms and definitions, technical requirements, plans, drawings, performance parameters, instructions for use, inspection requirements, marking, packaging, transportation and storage of non-contact silicon wafer transfer devices. This document applies to technical specifications for contactless silicon wafer transfer devices.

T/SHDSGY 160-2022 history

• 2023 T/SHDSGY 160-2023 Specification for cotton quality inspection service
• 2022 T/SHDSGY 160-2022 Technical specification for non-contact silicon wafert ransmission devices