DIN EN 60191-6-22 E:2011
Draft Document - Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball G...

Standard No.
DIN EN 60191-6-22 E:2011
Release Date
2011
Published By
SCC
Status
 2013-08
Replace By
DIN EN 60191-6-22:2013
Latest
DIN EN 60191-6-22:2013-08

DIN EN 60191-6-22 E:2011 history

  • 2013 DIN EN 60191-6-22:2013-08 Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Sil...
  • 2013 DIN EN 60191-6-22:2013 Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silico
  • 2011 DIN EN 60191-6-22 E:2011 Draft Document - Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball G...

DIN EN 60191-6-22 E:2011 -All Parts

DIN EN 60191-1 E:2017-05 Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices DIN EN 60191-3 Beiblatt 1:2006-08 Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits - Supplement 1: Extract of the terms DIN EN 60191-3:2000-07 Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits (IEC 60191-3:1999); German version EN 60191-3:1999 DIN EN 60191-4 A1 E:2017-04 DIN EN 60191-4:2019-02 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (IEC 60191-4:2013 + A1:2018); German version EN 60191-4:2014 + A1:2018 / Note: DIN EN 60191-... DIN EN 60191-6:2010-06 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages (IEC 60191-6:2009); German version EN 60191-6:2009 / Note: DIN EN 60191-6 (2005-04) rem...


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