IPC - Association Connecting Electronics Industries
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IPC 2222 ERTA-2009
Scope
This standard establishes the specific requirements for the design of rigid organic printed boards and other forms of component mounting and interconnecting structures. The organic materials may be homogeneous@ reinforced@ or used in combination with inorganic materials; the interconnections may be single@ double@ or multilayered.PurposeThe requirements contained herein are intended to establish specific design details that shall be used in conjunction with IPC-2221 (see 2.0) to produce detailed designs intended to mount and attach passive and active components.The components may be through-hole@ surface mount@ fine pitch@ ultra-fine pitch@ array mounting or unpackaged bare die. The materials may be any combination able to perform the physical@ thermal@ environmental@ and electronic function.Document HierarchyDocument hierarchy shall be in accordance with the generic standard IPC-2221.PresentationPresentation shall be in accordance with the generic standard IPC-2221.InterpretationInterpretation shall be in accordance with the generic standard IPC-2221.Classification of ProductsClassification of Products shall be in accordance with the generic standard IPC-2221 and as follows:Board TypeThis standard provides design information for different board types. Board types are classified as:Type 1 ?? Single-Sided Printed BoardType 2??? Double-Sided Printed BoardType 3??? Multilayer Board without Blind or Buried ViasType 4??? Multilayer Board with Blind and/or Buried ViasType 5??? Multilayer Metal-Core Board without Blind or Buried ViasType 6??? Multilayer Metal-Core Board with Blind and/or Buried ViasAssembly TypesA type designation signifies further sophistication describing whether components are mounted on one or both sides of the packaging and interconnecting structure.?Type 1 defines an assembly that has components mounted on only one side; Type 2 is an assembly with components on both sides. Type 2@ Class A is not recommended.Figure 1-1 shows the relationship of two types of assemblies.The need to apply certain design concepts should depend on the complexity and precision required to produce a particular land pattern or PI structure. Any design class may be applied to any of the end-product equipment categories; therefore@ a moderate complexity (Type 1B) would define components mounted on one side (all surface mounted) and when used in a Class 2 product (dedicated service electronics) is referred to as Type 1B@ Class 2. The product described as a Type 1B@ Class 2 might be used in any of the end-use applications; the selection of class being dependent on the requirements of the customers using the application.
IPC 2222 ERTA-2009 history
2009IPC 2222 ERTA-2009 Sectional Design Standard for Rigid Organic Printed Boards