The main technical contents involved in this document are: 1) requirements for optical reference points; 2) pad design requirements for structural parts; 3) pad design requirements for via holes; 4) pad design requirements for through-hole mounting devices; 5) Pad design requirements for surface mount devices; 6) Pad design requirements for large-area copper foil; 7) Design requirements for solder resist layer, solder paste layer and character layer.
T/CEIA 001-2023 history
2023T/CEIA 001-2023 Generic Requirements for Land Pattern Design of Electronic Measuring Instruments