BS IEC 62899-501-1:2019
Printed electronics - Quality assessment. Failure modes and mechanical testing. Flexible or bendable primary or secondary cells
- Standard No.
- BS IEC 62899-501-1:2019
- Release Date
- 2019
- Published By
- British Standards Institution (BSI)
- Latest
- BS IEC 62899-501-1:2019
- Scope
- What is BS IEC 62899 ‑ 501 ‑ 1 – Printed electronics about? BS IEC 62899 ‑ 501 ‑ 1 is a part of the multi-series standard that deals with the specifications for printed electronics. BS IEC 62899 ‑ 501 ‑ 1 specifies failure modes and mechanical stress test methods for the determination of reliability characteristics of bendable or flexible printed primary cells and secondary cells and batteries. BS IEC 62899 ‑ 501 ‑ 1 provides geometrical cell properties, mechanical characteristics, cell storage conditions such as storage temperature, temperature ranges, storage time, criteria for mechanical package damage, and heat generation for bendable or flexible pri...
BS IEC 62899-501-1:2019 history
- 2019 BS IEC 62899-501-1:2019 Printed electronics - Quality assessment. Failure modes and mechanical testing. Flexible or bendable primary or secondary cells
