DIN EN 60191-6-20:2011-03
Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ) (I...

Standard No.
DIN EN 60191-6-20:2011-03
Release Date
2011
Published By
German Institute for Standardization
Latest
DIN EN 60191-6-20:2011-03

DIN EN 60191-6-20:2011-03 history

  • 2011 DIN EN 60191-6-20:2011-03 Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ) (I...
  • 2011 DIN EN 60191-6-20:2011 Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ) (IEC
Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ) (I...

DIN EN 60191-6-20:2011-03 -All Parts




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