ISO 9455-5:2020
Soft soldering fluxes — Test methods — Part 5: Copper mirror test

Standard No.

ISO 9455-5:2020

Release Date

2020

Published By

International Organization for Standardization (ISO)

Latest

ISO 9455-5:2020

Scope

This document specifies a qualitative method for assessing the aggressiveness of a flux towards copper. The test is applicable to all fluxes of type 1 as defined in ISO 9454-1.

ISO 9455-5:2020 Referenced Document

• ISO 9455-1 Soft soldering fluxes — Test methods — Part 1: Determination of non-volatile matter, gravimetric method*， 2022-12-02 Update
• ISO 9455-2 Soft soldering fluxes; test methods; part 2: determination of non-volatile matter, ebulliometric method

ISO 9455-5:2020 history

• 2020 ISO 9455-5:2020 Soft soldering fluxes — Test methods — Part 5: Copper mirror test
• 2014 ISO 9455-5:2014 Soft soldering fluxes - Test methods - Part 5: Copper mirror test
• 1992 ISO 9455-5:1992 Soft Soldering Fluxes - Test Methods - Part 5: Copper Mirror Test First Edition (CEN EN 29455-5: 1993) (Second Edition)