EN 60191-6-22:2013
Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silico

Standard No.

EN 60191-6-22:2013

Release Date

2013

Published By

European Committee for Electrotechnical Standardization（CENELEC）

Latest

EN 60191-6-22:2013

Scope

IEC 60191-6-22:2012 provides the outline drawings and dimensions common to silicon-based package structures and materials of ball grid array packages (BGA) and land grid array packages (LGA).

EN 60191-6-22:2013 history

• 2013 EN 60191-6-22:2013 Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silico