This standard specifies the classification, requirements, test methods, inspection rules, packaging, marking, transportation and storage of epoxy potting materials for electronic components. This standard applies to the encapsulating materials required for various electronic components that use metal or plastic as molds or shells for potting.
SJ/T 11125-1997 history
1997SJ/T 11125-1997 Encapsulation materials of expoy series for use in electronic components