T/CWAN 0021-2021
Au-Sn solder preforms and recommended application profile (English Version)
- Standard No.
- T/CWAN 0021-2021
- Language
- Chinese, Available in English version
- Release Date
- 2021
- Published By
- Group Standards of the People's Republic of China
- Latest
- T/CWAN 0021-2021
- Scope
- This document specifies the technical requirements, inspection rules and application recommendations for gold-tin alloy preforms. This document applies to gold-tin alloy preform solder sheets for microelectronic device circuit packaging, semiconductor discrete device packaging and integrated circuit metal shell packaging.
T/CWAN 0021-2021 history
- 2021 T/CWAN 0021-2021 Au-Sn solder preforms and recommended application profile
