SJ 2709-1986
Methods of measurement for temperature of printed board assemblies (English Version)

Standard No.

SJ 2709-1986

Language

Chinese, Available in English version

Release Date

1986

Published By

Professional Standard - Electron

Status

Be replaced 2017-01

Replace By

SJ/T 2709-2016

Latest

SJ/T 2709-2016

Scope

This standard specifies the test methods for the ambient temperature, temperature field and surface temperature of installed components and devices of electronic equipment printed board assemblies under natural cooling conditions.

SJ 2709-1986 history

• 2016 SJ/T 2709-2016 Temperature test method for printed board assemblies
• 1986 SJ 2709-1986 Methods of measurement for temperature of printed board assemblies

SJ 2709-1986 Methods of measurement for temperature of printed board assemblies was changed to SJ/T 2709-2016 Temperature test method for printed board assemblies.