This standard specifies the integrity requirements and inspection and evaluation methods for the 1482 type bonding machine. This standard applies to type 1482 bonding machine. Bonding machines with similar structures used in the production of other semiconductor devices can also be implemented as a reference.
SJ/T 31070-1994 history
1970SJ/T 31070-1994 Integrity requirements and inspection and evaluation methods of 1482 bonder