T/JSSIA 0002-2017
Outline Dimensions of Flip Chip Ball Grid Array Package (English Version)

Standard No.

T/JSSIA 0002-2017

Language

Chinese, Available in English version

Release Date

2017

Published By

Group Standards of the People's Republic of China

Latest

T/JSSIA 0002-2017

Scope

Specifies the overall dimensions of flip chip ball grid array packages (FCBGA) and is suitable for finished product dimensional inspection and package design of flip chip ball grid array packages (FCBGA).

T/JSSIA 0002-2017 history

• 2017 T/JSSIA 0002-2017 Outline Dimensions of Flip Chip Ball Grid Array Package