IPC 7711 5.7.2-1998
BGA/CSP Installation Using Solder Paste to Prefill Lands

Standard No.

IPC 7711 5.7.2-1998

Release Date

1998

Published By

IPC - Association Connecting Electronics Industries

Latest

IPC 7711 5.7.2-1998

IPC 7711 5.7.2-1998 history

• 1998 IPC 7711 5.7.2-1998 BGA/CSP Installation Using Solder Paste to Prefill Lands